IVMSP-3.6
Terahertz Image Restoration Benchmarking Dataset
Yixiong Zhang, Zhipeng Su, School of Informatics Xiamen University (National Demonstrative Software School), Xiamen 361005, China, China; Feng Qi, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang 110016, China, China; Jianyang Zhou, School of Electronic Science and Engineering, Xiamen University, Xiamen, China, China; Xiao-Ping Zhang, Department of Electrical, Computer and Biomedical Engineering, Ryerson University, Canada, Canada
Session:
Image Processing
Track:
Image, Video, and Multidimensional Signal Processing
Location:
Gather Area I
Presentation Time:
Sun, 8 May, 21:00 - 21:45 China Time (UTC +8)
Sun, 8 May, 13:00 - 13:45 UTC
Sun, 8 May, 13:00 - 13:45 UTC
Session Chair:
Yi Zhou, National University of Singapore
Session IVMSP-3
IVMSP-3.1: Adaptive Actor-Critic Bilateral Filter
Bo-Hao Chen, Hsiang-Yin Cheng, Yuan Ze University, Taiwan; Jia-Li Yin, Fuzhou University, China
IVMSP-3.2: DOMAIN DECOMPOSITION ALGORITHMS FOR REAL-TIME HOMOGENEOUS DIFFUSION INPAINTING IN 4K
Niklas Kämper, Joachim Weickert, Saarland University, Germany
IVMSP-3.3: DEEP TEMPORAL INTERPOLATION OF RADAR-BASED PRECIPITATION
Michiaki Tatsubori, Takao Moriyama, Tatsuya Ishikawa, Paolo Fraccaro, Anne Jones, Blair Edwards, Julian Kuehnert, Sekou L. Remy, IBM Research, Japan
IVMSP-3.4: A NONLINEAR STEERABLE COMPLEX WAVELET DECOMPOSITION OF IMAGES
Zikai Sun, Thierry Blu, The Chinese University of Hong Kong, Hong Kong
IVMSP-3.5: KERNEL ESTIMATION NETWORK FOR BLIND SUPER-RESOLUTION
Xiang Cao, Haibo Shen, Liangqi Zhang, Yihao Luo, Tianjiang Wang, Huazhong University of Science and Technology, China
IVMSP-3.6: Terahertz Image Restoration Benchmarking Dataset
Yixiong Zhang, Zhipeng Su, School of Informatics Xiamen University (National Demonstrative Software School), Xiamen 361005, China, China; Feng Qi, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang 110016, China, China; Jianyang Zhou, School of Electronic Science and Engineering, Xiamen University, Xiamen, China, China; Xiao-Ping Zhang, Department of Electrical, Computer and Biomedical Engineering, Ryerson University, Canada, Canada