IEEE ICASSP 2022

2022 IEEE International Conference on Acoustics, Speech and Signal Processing

7-13 May 2022
  • Virtual (all paper presentations)
22-27 May 2022
  • Main Venue: Marina Bay Sands Expo & Convention Center, Singapore
27-28 October 2022
  • Satellite Venue: Crowne Plaza Shenzhen Longgang City Centre, Shenzhen, China

ICASSP 2022
ASPS-MMSP-L1: Applied Signal Processing and Multimedia Signal Processing
Wed, 25 May, 16:00 - 18:00 China Time (UTC +8)
Wed, 25 May, 08:00 - 10:00 UTC
Location: Peony Ballroom 4401AB, 4402-3
Session Co-Chairs: Teruhisa Misu, Honda Research Institute USA, Inc. and Zhiping Lin, Nanyang Tech. University, Singapore
Track: Applied Signal Processing Systems

ASPS-MMSP-L1.1: OPTIMIZING THE CONSUMPTION OF SPIKING NEURAL NETWORKS WITH ACTIVITY REGULARIZATION
Simon Narduzzi, Siavash A. Bigdeli, L. Andrea Dunbar, Centre suisse d'électronique et de microtechnique, Switzerland; Shih-Chii Liu, University of Zürich, Switzerland

ASPS-MMSP-L1.2: FAST FAULT DIAGNOSIS METHOD OF ROLLING BEARINGS IN MULTI-SENSOR MEASUREMENT ENVIROMENT
Zuozhou Pan, Zong Meng, Yanshan University, China; Zhiping Lin, Yuanjin Zheng, Nanyang Technological University, Singapore

ASPS-MMSP-L1.3: INVISIBLE AND EFFICIENT BACKDOOR ATTACKS FOR COMPRESSED DEEP NEURAL NETWORKS
Huy Phan, Yi Xie, Yingying Chen, Bo Yuan, Rutgers University, United States of America; Jian Liu, University of Tennessee, United States of America

ASPS-MMSP-L1.4: ROBUST ADAPTIVE NOISE CANCELLER ALGORITHM WITH SNR-BASED STEPSIZE CONTROL and NOISE-PATH GAIN COMPENSATION
Akihiko Sugiyama, Yahoo Japan Corporation, Japan

ASPS-MMSP-L1.5: LATENT SPACE SLICING FOR ENHANCED ENTROPY MODELING IN LEARNING-BASED POINT CLOUD GEOMETRY COMPRESSION
Nicolas Frank, Davi Lazzarotto, Touradj Ebrahimi, École Polytechnique Fédérale de Lausanne (EPFL), Switzerland

ASPS-MMSP-L1.6: INCORPORATING GAZE BEHAVIOR USING JOINT EMBEDDING WITH SCENE CONTEXT FOR DRIVER TAKEOVER DETECTION
Yuning Qiu, Carlos Busso, University of Texas at Dallas, United States of America; Teruhisa Misu, Kumar Akash, Honda Research Institute USA, Inc., United States of America