IEEE ICASSP 2022

2022 IEEE International Conference on Acoustics, Speech and Signal Processing

7-13 May 2022
  • Virtual (all paper presentations)
22-27 May 2022
  • Main Venue: Marina Bay Sands Expo & Convention Center, Singapore
27-28 October 2022
  • Satellite Venue: Crowne Plaza Shenzhen Longgang City Centre, Shenzhen, China

ICASSP 2022
SS-14: Group Theory for Sensing, Imaging, and Learning Applications
Thu, 12 May, 21:00 - 21:45 China Time (UTC +8)
Thu, 12 May, 13:00 - 13:45 UTC
Location: Gather Area A
Session Co-Chairs: Kumar Vijay Mishra, United States Army Research Laboratory and Ali Pezeshki, Colorado State University and A. Robert Calderbank, Duke University
Track: Special Sessions

SS-14.1: SPARSE MULTI-REFERENCE ALIGNMENT: SAMPLE COMPLEXITY AND COMPUTATIONAL HARDNESS
Tamir Bendory, Tel Aviv University, Israel; Oscar Mickelin, Amit Singer, Princeton University, United States of America

SS-14.2: Grassmannian Dimensionality Reduction Using Triplet Margin Loss for UME Classification of 3D Point Clouds
Yuval Haitman, Joseph Francos, Ben-Gurion University, Israel; Louis Scharf, Colorado State University, United States of America

SS-14.3: A NOTE ON TOTALLY SYMMETRIC EQUI-ISOCLINIC TIGHT FUSION FRAMES
Matthew Fickus, Air Force Institute of Technology, United States of America; Joseph Iverson, Iowa State University, United States of America; John Jasper, South Dakota State University, United States of America; Dustin Mixon, The Ohio State University, United States of America

SS-14.4: A SIMPLE FORMULA FOR THE MOMENTS OF UNITARILY INVARIANT MATRIX DISTRIBUTIONS
Stephen D. Howard, Defence Science and Technology Group, Australia; Ali Pezeshki, Colorado State University, United States of America

SS-14.5: MATCHED MANIFOLD DETECTION FOR GROUP-INVARIANT REGISTRATION AND CLASSIFICATION OF IMAGES
Ziv Yavo, Yuval Haitman, Joseph Francos, Ben Gurion University, Israel; Louis Scharf, Colorado State University, United States of America

SS-14.6: Image Restoration via Reconciliation of Group Sparsity and Low-Rank Models
Zhiyuan Zha, Bihan Wen, Nanyang Technological University, Singapore; Xin Yuan, Nokia Bell Labs, United States of America; Jiantao Zhou, University of Macau, China; Ce Zhu, University of Electronic Science and Technology of China, China