IEEE ICASSP 2022

2022 IEEE International Conference on Acoustics, Speech and Signal Processing

7-13 May 2022
  • Virtual (all paper presentations)
22-27 May 2022
  • Main Venue: Marina Bay Sands Expo & Convention Center, Singapore
27-28 October 2022
  • Satellite Venue: Crowne Plaza Shenzhen Longgang City Centre, Shenzhen, China

ICASSP 2022
IVMSP-32: Applications IV
Wed, 11 May, 23:00 - 23:45 China Time (UTC +8)
Wed, 11 May, 15:00 - 15:45 UTC
Location: Gather Area J
Session Chair: Rong Tong, Singapore Institute of Technology
Track: Image, Video, and Multidimensional Signal Processing

IVMSP-32.1: SINGLE-SHOT BALANCED DETECTOR FOR GEOSPATIAL OBJECT DETECTION
Yanfeng Liu, Qiang Li, Yuan Yuan, Qi Wang, Northwestern Polytechnical University,, China

IVMSP-32.2: REGULARIZED LATENT SPACE EXPLORATION FOR DISCRIMINATIVE FACE SUPER-RESOLUTION
Ruixin Shi, Junzheng Zhang, Shiming Ge, Institute of Information Engineering, Chinese Academy of Sciences; School of Cyber Security, University of Chinese Academy of Sciences, China; Yong Li, Institute of Information Engineering, Chinese Academy of Sciences, China

IVMSP-32.3: ENHANCING AND DISSECTING CROWD COUNTING BY SYNTHETIC DATA
Yi Hou, Yuheng Lu, Yuan Li, Huizhu Jia, Xiaodong Xie, National Engineering Laboratory for Video Technology, Peking University, China; Chengyang Li, School of Electronics Engineering and Computer Science, Peking University, Beijing, China, China; Liping Zhu, Key Lab of Petroleum Data Mining, China University of Petroleum (Beijing), China

IVMSP-32.4: MULTI-POSE VIRTUAL TRY-ON VIA SELF-ADAPTIVE FEATURE FILTERING
Chenghu Du, Feng Yu, Minghua Jiang, Xiong Wei, Tao Peng, Xinrong Hu, Wuhan Textile University, China

IVMSP-32.5: HISTOGRAM-GUIDED SEMANTIC-AWARE COLORIZATION
Jie Zhang, Yi Xiao, Guo Chen, Qingping Sun, Fangqiang Xu, Hunan University, China; Chi-Sing Leung, City University of Hong Kong, Hong Kong

IVMSP-32.6: CONTENT PRESERVING SCALE SPACE NETWORK FOR FAST IMAGE RESTORATION FROM NOISY-BLURRY PAIRS
Green Rosh K S, Nikhil Krishnan, B H Pawan Prasad, Sachin Lomte, Samsung R&D Institute India, Bangalore, India