| TU2.L9: Active/Passive Microwave Remote Sensing of Terrestrial Snow II | 
| Session Type: Oral | 
| Time: Tuesday, July 25, 10:40 - 12:20 | 
| Location: Room 203 A | 
| Session Chairs: Jiancheng Shi, Institute of Remote Sensing and Digital Earth, Chinese Academy of Sciences and Martti Hallikainen, Aalto University | 
| 10:40 - 11:00 | 
| TU2.L9.1: FUTURE MISSION CONCEPTS FOR MEASURING SNOW MASS | 
| Juha Lemmetyinen; Finnish Meteorological Institute | 
| Kimmo Rautiainen; Finnish Meteorological Institute | 
| Kari Luojus; Finnish Meteorological Institute | 
| Helmut Rott; ENVEO IT GmbH | 
| Thomas Nagler; ENVEO IT GmbH | 
| Giuseppe Parrella; German Aerospace Center (DLR) | 
| Irena Hajnsek; German Aerospace Center (DLR) | 
| Chris Derksen; Environment and Climate Change Canada | 
| Giovanni Macelloni; Institute of Applied Physics | 
| Marco Brogioni; Institute of Applied Physics | 
| Andreas Wiesmann; GAMMA Remote Sensing AG | 
| Christian Mätzler; GAMMA Remote Sensing AG | 
| Michael Kern; European Space Agency (ESA) | 
| 11:00 - 11:20 | 
| TU2.L9.2: MICROWAVE EMISSION FROM ALPINE SNOW: EXPERIMENTAL DATA AND ELECTROMAGNETIC MODELS | 
| Emanuele Santi; IFAC-CNR | 
| Simone Pettinato; IFAC-CNR | 
| Simonetta Paloscia; IFAC-CNR | 
| Paolo Pampaloni; IFAC-CNR | 
| Enrico Palchetti; IFAC-CNR | 
| Chuan Xiong; RADI-CAS | 
| Andrea Crepaz; Avalanche Center, Arabba, Italy | 
| 11:20 - 11:40 | 
| TU2.L9.3: MICROWAVE BRIGHTNESS TEMPERATURE OF SNOW ON TERRAIN AND LAKE ICE REVISITED: DATA AND SIMULATIONS | 
| Martti Hallikainen; Aalto University | 
| 11:40 - 12:00 | 
| TU2.L9.4: FULL WAVE SIMULATION OF SNOWPACK APPLIED TO MICROWAVE REMOTE SENSING OF SEA ICE | 
| Shurun Tan; University of Michigan | 
| Jiyue Zhu; University of Michigan | 
| Leung Tsang; University of Michigan | 
| Son Nghiem; California Institute of Technology | 
| 12:00 - 12:20 | 
| TU2.L9.5: SNOWPACK TIME-SERIES GROUND TRUTH VIA A LOW-POWER DATALOGGER | 
| Roger De Roo; University of Michigan | 
| Steve Rogacki; University of Michigan | 
| Eric Haengel; Leidos, Inc. | 
| Chandler Ekins; University of Michigan |