Technical Program

MMSP-P3: Virtual Reality and Robotics

Session Type: Poster
Time: Friday, March 25, 16:00 - 18:00
Location: Poster Area A
Session Chair: Petros Maragos, National Technical University of Athens
 
MMSP-P3.1: TOWARDS A BEHAVIORALLY-VALIDATED COMPUTATIONAL AUDIOVISUAL SALIENCY MODEL
         Antigoni Tsiami; National Technical University of Athens
         Athanasios Katsamanis; National Technical University of Athens
         Petros Maragos; National Technical University of Athens
         Argiro Vatakis; Cognitive Systems Research Institute
 
MMSP-P3.2: BINAURAL SOUND GENERATION CORRESPONDING TO OMNIDIRECTIONAL VIDEO VIEW USING ANGULAR REGION-WISE SOURCE ENHANCEMENT
         Kenta Niwa; NTT Corporation
         Yuma Koizumi; NTT Corporation
         Kazunori Kobayashi; NTT Corporation
         Hisashi Uematsu; NTT Corporation
 
MMSP-P3.3: DEPTH FUSED FROM INTENSITY RANGE AND BLUR ESTIMATION FOR LIGHT-FIELD CAMERAS
         Yatong Xu; Shenzhen Key Lab of Broadband Network and Multimedia, Graduate School at Shenzhen, Tsinghua University
         Xin Jin; Shenzhen Key Lab of Broadband Network and Multimedia, Graduate School at Shenzhen, Tsinghua University
         Qionghai Dai; Shenzhen Key Lab of Broadband Network and Multimedia, Graduate School at Shenzhen, Tsinghua University
 
MMSP-P3.4: AUTOCALIBRATION OF LIDAR AND OPTICAL CAMERAS VIA EDGE ALIGNMENT
         Juan Castorena; New Mexico State University
         Ulugbek Kamilov; Mitsubishi Electric Research Laboratories
         Petros Boufounos; Mitsubishi Electric Research Laboratories
 
MMSP-P3.5: SOURCE LOCALIZATION ON SOLIDS UTILIZING LOGISTIC MODELING OF ENERGY TRANSITION IN VIBRATION SIGNALS
         Quang Hanh Nguyen; Nanyang Technological University
         Gopalan Reju Vaninirappuputhenpurayil; Nanyang Technological University
         Andy W. H. Khong; Nanyang Technological University
 
MMSP-P3.6: PATTERN-BASED 3D MODEL COMPRESSION
         Kangying Cai; Technicolor R&D France
         Wenfei Jiang; Technicolor R&D Beijing
         Tao Luo; Technicolor R&D France
         Jiang Tian; Technicolor R&D Beijing
 

ICASSP 2016 Patrons