Authors: |
Zhe Wang, Shenzhen Key Lab of comp.vis&Pat. Rec., Shenzhen Institutes of Advanced Technology, CAS / Department of Informantion Engineering, The Chinese University of Hong Kong, China; Yali Wang, Shenzhen Key Lab of comp.vis&Pat. Rec., Shenzhen Institutes of Advanced Technology, CAS, China; Limin Wang, Shenzhen Key Lab of comp.vis&Pat. Rec., Shenzhen Institutes of Advanced Technology, CAS / Department of Informantion Engineering, The Chinese University of Hong Kong, China; Yu Qiao, Shenzhen Key Lab of comp.vis&Pat. Rec., Shenzhen Institutes of Advanced Technology, CAS, China |