Technical Program

IVMSP-L2: Image Quality

Session Type: Lecture
Time: Monday, March 6, 16:00 - 18:00
Location: Grand Salon 3
Session Chair: Al Bovik, University of Texas at Austin
 
IVMSP-L2.1: FROM IMAGE QUALITY TO PATCH QUALITY: AN IMAGE-PATCH MODEL FOR NO-REFERENCE IMAGE QUALITY ASSESSMENT
         Wen Heng; National Engineering Laboratory for Video Technology, Cooperative Medianet Innovation Center, School of Electronics Engineering and Computer Science, Peking University
         Tingting Jiang; National Engineering Laboratory for Video Technology, Cooperative Medianet Innovation Center, School of Electronics Engineering and Computer Science, Peking University
 
IVMSP-L2.2: UNIQUE: UNSUPERVISED IMAGE QUALITY ESTIMATION
         Dogancan Temel; Georgia Institute of Technology
         Mohit Prabhushankar; Georgia Institute of Technology
         Ghassan AlRegib; Georgia Institute of Technology
 
IVMSP-L2.3: STATISTICS OF NATURAL FUSED IMAGE DISTORTIONS
         David Eduardo Moreno-Villamarín; Pontificia Universidad Javeriana, Seccional Cali
         Hernán Darío Benítez-Restrepo; Pontificia Universidad Javeriana, Seccional Cali
         Alan Conrad Bovik; The University of Texas at Austin
 
IVMSP-L2.4: NIQSV: A NO REFERENCE IMAGE QUALITY ASSESSMENT METRIC FOR 3D SYNTHESIZED VIEWS
         Shishun Tian; National Institute of Applied Sciences (INSA Rennes)
         Lu Zhang; National Institute of Applied Sciences (INSA Rennes)
         Luce Morin; National Institute of Applied Sciences (INSA Rennes)
         Olivier Déforges; National Institute of Applied Sciences (INSA Rennes)
 
IVMSP-L2.5: GRADIENT MAGNITUDE SIMILARITY DEVIATION ON MULTIPLE SCALES FOR COLOR IMAGE QUALITY ASSESSMENT
         Bo Zhang; Hong Kong University of Science and Technology
         Pedro V. Sander; Hong Kong University of Science and Technology
         Amine Bermak; Hong Kong University of Science and Technology
 
IVMSP-L2.6: REGISTRATION BASED RETARGETED IMAGE QUALITY ASSESSMENT
         Bo Zhang; Hong Kong University of Science and Technology
         Pedro V. Sander; Hong Kong University of Science and Technology
         Amine Bermak; Hong Kong University of Science and Technology